Data storage architecture poised for disruption in 2020
Experts predict edge computing, 5G and containers will fuel computational storage, new storage systems dedicated to container-based applications, and flash-based object stores.
Big Data Predictions: What 2020 Will Bring
The World Economic Forum predicts that the amount of data we produce will reach 44 zettabytes by 2020. Learn more about it here.
Digital Storage Projections For 2020, Part 2
Toshiba introduced during the 2019 Flash Memory Summit the XFMEXPRESS, targeted at mobile apps, automobiles, and gaming consoles.
NGD Systems 2020 Predictions: NVMe, 5G and Content Delivery Networks
As the amount of data intensively swells and impacts compute applications, a change in handling the growing strain produced will be necessary for 2020. Read what they are in this post.
NVMe Computational Storage Predictions For 2020: CDN, 5G And More
Nader Salessi, the CEO and NGD Systems’ founder, has predictions about how enterprises relying on the hyper-scale, edge, and CDN environments will store and process data in 2020. Read more here.
NVMe Computational Storage Reinvigorates Storage in a Novel Way
Computational storage (CS) offers a faster, more affordable and power-efficient way to store and analyze petabytes of data. Get started here.
What’s the difference between NVMe computational storage and storage computation in memory? Let’s find out
nCorium rejects the idea of performing compute in storage to accelerate storage IO; intends to deliver storage computation in memory. Find out more here.
NGD Awarded 30th Patent
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Addressing Edge Computing Needs with Advanced Data Storage
The Storage Networking Industry Association aims to lead the storage industry in developing and promoting vendor-neutral architectures, standards, and educational services that facilitate the efficient management, movement, and security of information.
Utilizing Computational Memory
Sylvain Dubois, Vice President, Business Development and Strategic Marketing for Crossbar, identified ReRAM as a CMOS back-end of line technology which can be integrated between the metal routing layers of the CMOS.